Keep pulling the thread on Dr. Tien Wu.
Since Dr. Tien Wu joined in 2000, ASE's annual revenue has grown from $1 billion to $22 billion.
TSMC's CoWoS advanced packaging technology was the result of a 20-year development effort that required significant investment for 18 years before becoming commercially successful.
ASE's decision to exit its manufacturing operations in China was driven solely by geopolitical factors and the strategic imperative to maintain the trust of its U.S. customers.
ASE's leadership believes that losing the trust of its American customer base would sever its access to future technology roadmaps, which is critical to its long-term business model.
Dr. Tien Wu believes it is "very, very achievable" for the semiconductor industry to reach $1 trillion in annual revenue by 2030.
ASC Group is the largest semiconductor test and packaging company in the world.
ASC Group has a higher market share in high-end semiconductor packaging and a lower market share in legacy packaging.
The slowing of Moore's Law has diminished performance optimization at the single-chip level, leading to the rise of "system Moore's law" which focuses on system-level integration through advanced packaging.
In the year 2000, IBM's revenue was $88 billion, compared to ASE's $1 billion and TSMC's $5 billion.
Dr. Tien Wu's decision to leave IBM for ASE in 2000 was driven by his assessment that semiconductor manufacturing was migrating to Asia and was no longer a strategic focus for IBM.
ASE operates approximately 30,000 wire bonders, of which around 25,000 are fully depreciated but remain in active use.
Dr. Tien Wu predicts that demand for AI-related semiconductor capacity will continue to grow for the next 20 years.